The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system. This wafer handling system provides automatic loading from the cassette， bump testing (shear or pull)， and then unloading of the six or eight inch wafers.
The Nordson DAGE 4000W Wafer Handling System provides significant advantages:
Overcomes the need for manual handling of expensive bumped wafers
Overcomes the need for operator control of loadtool to bump alignment
Increased throughput of bump testing
Key Features
Semi-automatic handling of wafers from cassette to bondtester
Semi-automatic bump shear testing
Semi-automatic transfer of tested wafer back to cassette
Wafer orientation and safety interlocks
Automatic cassette scan to check location of wafers and the presence of any cross slotted wafers
Automated bump shear routines (no camera system needed)
240mm joystick controlled precision XY stage
