The Nordson DAGE 4300 bondtester complements the proven semi-automatic 4000W Wafer Handling System and has been designed in accordance with the strict standards of semiconductor foundries and subcontractors to meet the growing demand for handling and bump shear testing on 300mm wafers.
The Nordson DAGE 4300 bondtester offers similar advantages as the 4000W Wafer Handling System with regard to avoiding the manual handling of valuable wafers and increased productivity in bump testing. The 4300 bondtester:
Overcomes the need for manual handling of expensive bumped wafers
Overcomes the need for operator control of loadtool to bump alignment
Increases throughput of bump testing
Key Features
Joystick manipulation of the test head over 100% of wafer surface without repositioning the wafer on the chuck
Semi-automatic test routines for bondtesting of the entire wafer surface without repositioning the wafer on the chuck (no camera system needed). 2 reference points needed per wafer
460mm x 300mm XY stage
Wafer size 200mm or 300mm
Optional image capture system
360 degree manual chuck rotation
360 degree loadtool rotation. Automatic during auto test; manual under joystick control
Safety interlocks on wafer chuck
Frame protection for 300mm wafer
Provision for interface to customer's robot handler and other SMIF equipment
