粉体行业在线展览
粉体行业在线展览
高频高速基材
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生益科技
江苏
面议
高频高速基材
1461
*Certified to IPC-4204/11 Copper Clad Adhesiveless
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°) | IPC-TM-650 2.4.9D | Accepted | N/mm | 0.9 |
| 288℃, 5s | 0.9 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Dimensional Stability | IPC-TM-650 2.2.4B | After Etched | % | -0.0391/-0.0499 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % | 97 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 126 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm | 4.51×108 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ | 1.71×105 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 2.92 |
| Dissipation Factor (10GHz) | SPDR | C-24/23/50 | - | 0.0032 |
| Folding Endurance | JIS C-6471 | R0.38×4.9N | Times | ＞1000 |
| Flammability | UL94 | E-24/125 | Rating | V-0 |
