粉体行业在线展览
面议
674
LGP 250-P是专门为小规模抛光操作设计的设备。此设备坚固,简单易用,以*小的投资同样得到高质量的抛光表面。转速可调节范围10-600rpm。抛光过程需要配合抛光布或磁性抛光盘来使用。本设备提供带有支架的抛光头,同时抛光4个薄片。抛光头的压力可调节,单个样品**可到施压200克。设备共有两套样品支架,适用于30x45厘米(1x1.5英寸)的样品。
重量:50公斤
尺寸:526×589×380毫米
电源:220VAC,50/60Hz
研磨盘直径:250毫米
研磨盘转速:10-600转/分钟
低速时也无振动
易于快速清洁
同时处理*多四个样品
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The LGP 250-P is a single purpose apparatus specifically designed for small-scale polishing operations. The robust, simple to use system provides high quality polished chips and thin sections with the minimum capital investment. The disc speed can be varied from 10-600 rpm. Polishing is achieved by means of polishing cloths or magnetic polishing discs. A polishing head with four holders for the chip or thin section production is supplied. The former allows efficient, simultaneous polishing of up to 4 samples. Variable up to 200 gram weights apply a force to hold the sample’s position on the disc. Two sets of four specimen holders are supplied to suit either 30x45mm or 1 x 1.5 inch samples. Variable speed: Plate diameter: Dimensions: Weight: Power supply: |
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