粉体行业在线展览
bohp
80-90万元
bohp
2038
规格:
高纯铅:99.999% Pb-5N-I-10
检测杂质:Ag, Al, As, Bi, Cd, Fe, Mg, Ni, Sb, Sn, Zn
杂质总含量:≤10ppm
高纯铅:99.9999% Pb-6N-I-11
检测杂质:Ag, Al, As, Bi, Cu, Fe, Mg, Sn
杂质总含量:≤1ppm
高纯铅:99.99999% Pb-7N-I-44
检测杂质:Ag, Al, Bi, Cd, Cu, Fe, Mn, Ni, Sn, Zn
杂质总含量:≤0.1ppm
用途:主要用于制备化合物半导体、致冷元件、红外光电转换器件、高效温差元件以及焊料等。
包装:涤纶薄膜包装后双层复合膜真空封装或直接玻璃管真空包装。
Specification:
High purity Pb: 99.999% Pb-5N-I-10
Testingimpurity: Ag, Al, As, Bi, Cd, Fe, Mg, Ni, Sb, Sn, Zn
Total impurity content: ≤10ppm
High purity Pb: 99.9999% Pb-6N-I-11
Testing impurity: Ag, Al, As, Bi, Cu, Fe, Mg, Sn
Total impurity content: ≤1ppm
High purity Pb: 99.99999% Pb-7N-I-44
Testing impurity: Ag, Al, Bi, Cd, Cu, Fe, Mn,Ni, Sn, Zn
Total impurity content: ≤0.1ppm
Application: Leadis primarily used in the manufacture of compound semiconductor, refrigeratingelement, infrared photoelectric converting device, high efficientthermo-element and solder etc.
Package: Packedwith terylene film, and double poly-film with vacuum encapsulation. Packed withglass tube with vacuum encapsulation directly.