粉体行业在线展览
粉体行业在线展览
SiC籽晶粘接设备
直接联系
山东力冠微电子装备有限公司
山东
面议
山东力冠
SiC籽晶粘接设备
291
产品概述/Product Introduction：
♦ 籽晶的粘接工艺技术是将SiC籽晶通过有机胶粘接在石墨纸上。提高籽晶粘接质量是保证高品质SiC晶体生长的首要前提。
The bonding technology of seed crystal is to bond SiC seed crystal to graphite paper through organic adhesive. Improving the bonding quality of seed crystal is the first prerequisite to ensure the growth of high-quality SiC crystal. .
技术指标/Technical Indicators：
晶圆尺寸: 6-8英寸 Wafer size: 6-8 inches | 温度350-1000°C,温度均匀性土3°C Temperature 350 1000°C, temperature uniformity 3°C |
压力:**1-2万KN，力均匀性<士1% Pressure: Maximum 1-20,000 KN, Force Uniformity<土1% | 真空度:≤10Pa Vacuum degree:≤10Pa |
压头:柔性压头/硬性压头 Indenter: Flexible indenter/rigid indenter |
